Qualcomm, which has more or less dominated the mobile chipset industry with its Snapdragon product line, will be exclusively dedicated to Intel and AMD PCs with the development of a new Snapdragon 1000 series chip.
Last year in December Qualcomm had the offer of & # 39; always connected PCs & # 39;powered by the Snapdragon 835 processor and running on the modified Windows 10 S. report by WinFutureThese PCs will come out later this year and will be changed to fit the recently announced Lion's Mouth 850 Chipset.
However, the Snapdragon 1000 chipset (codenamed SDM1000) should deliver as much processing power as an Intel Y-Series or U-Series chipset, according to the report.
WinFuture Also notes that the TDP of the SDM1000 is about 12 watts, and thus comes within reach of Intel chips of the Y and U series with extremely low power consumption. For reference, Apple's 12-inch MacBook uses an Intel Y-Series CPU, and more Ultrabooks use U-Series chips.
TDP or Thermal Design Power is a unit that defines the maximum heat generated by a chip in the field. As a rule of thumb, the higher the TDP, the more powerful the processor. Intel's Y and U series chips can deliver 15 watts.
Despite the matching TDP, the SDM1000 is unlikely to adapt the Intel CPUs for flexibility, bandwidth, and raw performance yet. On the other hand, the architecture could be much more efficient than Intel's chips, offering 2-3 times longer battery life. As long as the chip is strong enough for regular use, the trade-off should not matter.
In other words, Intel really needs to worry.
Of course, the SDM1000 will also be designed specifically for small, thin laptops. In fact, Taiwanese electronics giant ASUS, who together with Qualcomm unveiled the NovaGO PC "Always Connected" in December, is working on a device code-named "Primus" that will use the SDM1000 in its reference design. The device has no expected release date, but we should learn more about it soon.
The report said the Snapdragon 1000 development platform had 16GB LPDDR4X RAM and two 128GB UFS 2.1 rated memory modules on board. There also seems to be support for Gigabit WLAN, the Snapdragon 850 software modem and a new power management chip for increased power consumption.
In addition, the report states that the Snapdragon 1000 will be a "socketed" chip, which means that the SoC will not be soldered to the motherboard, which could mean that the chip can be replaced.
The SDM1000 has dimensions of 20 x 15 millimeters and is thus larger than the Snapdragon 850 with the dimensions 12.4 x 12.4 mm. However, this is still smaller than an average Intel processor having dimensions of 45×24 mm.