Bluetooth Core 7.0 HDT Silicon Deployment to Offer 7.5 Mbps Data Rates

The adoption of Bluetooth Core 7.0 in November 2026 introduces High Data Throughput (HDT) with physical layer data rates reaching up to 7.5 Mbps, wifinowglobal.com reported.

This leap surges past the previous Bluetooth LE maximum of 2 Mbps, establishing a solid foundation for lossless audio, spatial computing, and industrial applications.

Semiconductor manufacturers are scrambling to build compatible hardware. Qualcomm supplies the QCC5181 supporting LE Audio and Auracast alongside Snapdragon Sound technologies. Qualcomm's FastConnect 8800 integrates Wi-Fi 8, Bluetooth, UWB, and Thread, featuring announced support for Bluetooth Channel Sounding and HDT.

Other major players are carving out distinct technical territory. MediaTek offers the Dimensity 9200 for LE Audio and Auracast, alongside the Filogic 380 combining Wi-Fi 7 with manufacturer-described HDT support. However, wifinowglobal.com noted that conformance of that earlier MediaTek HDT implementation with the final Bluetooth Core 7.0 specification remains unverified.

Meanwhile, Silicon Labs focuses on low-power IoT with its EFR32BG24 and BG24L platforms supporting Channel Sounding development. Synaptics supplies the SYN4390 combining Wi-Fi 7, Bluetooth 6.0, and IEEE 802.15.4 connectivity, with a published product brief explicitly confirming LE Audio and Bluetooth Channel Sounding distance measurement.

Audio infrastructure relies heavily on broadcast advances like Auracast. The core of this technology is LE Audio, which uses the LC3 codec developed by Fraunhofer IIS in collaboration with Ericsson and the Bluetooth SIG to offer a better ratio of audio quality to energy consumption.

Component developers are pushing licensable silicon IP to accelerate this transition. CEVA provides licensable Bluetooth IP supporting LE Audio, Auracast, Channel Sounding, and HDT up to 7.5 Mbps, with more than ten HDT IP licensees disclosed, including Actions Technology’s ATS296X audio chipset family. Nordic Semiconductor demonstrated prototype HDT silicon in October 2026 and is developing an HDT-capable SoC, complementing its nRF54 family which provides Channel Sounding capabilities.